The Aemtec and AT&S in Leoben, based in Berlin, are pleased to be able to announce a deepening of their existing business relationships. In its new research and production center in Styria, AT&S will in future manufacture highly complex IC substrates for AEMTEC, which are used in test machines for powerful microchips. The qualification process in Leoben is already in full swing and mass production will start in the fourth quarter of this year.
This cooperation between two European technology market leaders is an important step towards a robust and sustainable semiconductor ecosystem for Europe. This demonstrates for the first time in Europe that the capacity for the local production of modern IC substrates in high volumes is available for semiconductor and microelectronic industries.
“We are very proud that we have built Europe in Europe’s first IC substrate and Advanced Packaging Competence Center,” says Ingolf Schröder, EVP BU Microelectronics at AT & S, and continues: “For the first time, we can cover an important part of the supply chains for the semiconductor production locally, with self-developed top and short and secure Transport paths.
“Advanced technologies and new cooperation models are essential in the overall society. We are happy to have found a long-term partner for the production of IC substrates in Europe. Aemtec.
AT&S as a pioneer in Europe
The substrates and components that AT&S delivers to Aemtec are an essential part of the control of the modules that produce AemTec for semiconductor test machines and, thanks to the brave investments that have been made for new research and production capacities in Leoben, can be manufactured for the first time in Europe. This confirms that the long-standing strategy of AT&S is working on the expansion and structure of a modern microelectronic ecosystem in Europe. AT&S has been cooperating in several EU-funded projects with other European electronics and semiconductor manufacturers and leading research institutions for years to develop new technologies and to integrate them into production.
In Austria and Europe, AT&S has established itself as a driving force for an independent, local high-tech industry and, in addition to the expansion of capacities in Asia, was carried out, especially at the Leoben Hinterberg location. This will to design and the increasing networking with European partners have made a significant contribution to the fact that nails are now being made with their heads at the political level: The new IC substrate competence center has benefited as part of the large-scale funding initiatives “Important Projects of Common European Interest” (IPCEI). The geopolitical environment currently in uncertainty will further reinforce the European efforts in future -related key technologies and AT&S is ready to actively shape the expansion of the microelectronic ecosystem with a growing and robust network of reliable partners.
AT & S Austria Technology & System Technology Aktiengesellschaft – Advanced Technologies & Solutions
AT&S is a worldwide leading manufacturer of high-quality IC substrates and circuit boards as well as developers of future connection technologies for the core areas of mobile devices, automotive & aerospace, industrial, medical and high-performance computing for VR and AI applications. AT&S has a global presence with production locations in Austria (Leoben, Fehring) as well as works in India (Nanjangud) and China (Shanghai, Chongqing). A new high-end production facility for IC substrates was put into operation in Malaysia (Kulim), and large-scale production started in early 2025. AT&S Europe’s first competence center for R&D and IC substrate production built in Leoben, which was opened in June 2025. The company employs around 13,000 people worldwide: inside. Further information also under www.ats.net
Aemtec – Europe’s competence in Customized Advanced Packaging
Aemtec is one of the world’s leading specialists in the field of development and production of complex micro and optoelectronic modules up to complete system integration. The wide technology portfolio includes Wafer Back-End Services including Wafer Test, Chip on Board, Flip Chip, 3D Integration and Opto Packaging. Aemtec convinces with complex and reliable solutions in the breadth of miniaturization. The extensive range of services includes design and development, industrialization, qualification, prototyping (NPI), tests, wafer and frame probing, series production as well as supply chain management and after sales services. Customers from Medicine, Semicon, Industry, DataCom as well as aerospace and defense area appreciate Aemtecs Competence in the Advanced Packaging area. www.AEMtec.com